Gelid Solutions GP-Ultimate - Thermal Pad 90x50x1.5mm. Excellent Heat Conduction, Ideal Gap Filler. Easy Installation Thermal Conductivity 15W
ULTIMATE THERMAL CONDUCTIVITY: With a thermal conductivity of 15W / mK, the GP-ULTIMATE offers first-class performance.
SIMPLE APPLICATION: The GP-ULTIMATE is easy to use thanks to its thermal dimensions of 90x50mm.
NON-ELECTRICAL CONDUCTIVITY: The GP-ULTIMATE is non-electrically conductive, non-corrosive, non-hardening and non-toxic
PERFECT SIZES: The GP-ULTIMATE sizes are perfect for PCB surfaces, VGA cards, laptops, game consoles, microcontrollers, memory ICs and other SMD components.
AVAILABILITY OF THE THIN: The GP-ULTIMATE is available in different thicknesses of 0.5, 1.0, 1.5, 2.0 and 3.0mm
Description
This listing is for 1 x 5g tubes of quality high conductivity silicone thermal glue.
With a thermal conductivity greater than 0.975 w/m-k this strong silicone based glue is perfect for use with our range of high-power LEDs. This glue is also suitable for other high temperature applications such as transistor cooling. This glue is also electrically non-conductive. Please note that thermal glue is not recommended for bonding CPUs to heatsinks here you should use Thermal Grease.
This product is fully CE and RoHS compliant and provides a safe and affordable solution to safely dissipate heat away from your components directly to a heat sink. The utilisation of a good quality high thermal conductive glue/compound is essential to keep components cool, prolong their life and allow them to perform at optimal levels.
Each tube contains 5 grams of thermal glue that will suffice for the installation of around 10 x 1W / 3W LEDs with PCB directly onto a heat sink.
*Please kindly note that this is a thermal glue NOT a thermal compound and provides a near permanent bond for components.
Technical Specifications
Colour White -
Thermal Conductivity 0.975 W/m-K
Hardness 78±5 -
Specific Gravity 2.3g/cm²
Tensile Strength 2.1Mpa
Dry Time 5-15 Mins
Elongation At Break 70%
Shear Strength 1.8Mpa
Dielectric Strength 10KV/MM
Operation Temperature -600 -200°C
Ingredient Percentage Composition
Crossing Agent 10%
Silicone Material 30%
Thermal Conductive Material 40%
Strength Fillers 20%
Package contains:
1 X Halnziye HY910 5g conductivity silicone thermal glue.
Specifics
- Item must be returned within: 14 Days
- Refund will be given as: Money Back
- Type: Thermal Pad
- All returns accepted: Returns Accepted
- Return shipping will be paid by: Buyer
- Brand: GELID Solutions
- Condition: New